Submitted by: kirkland on Saturday October 28th, 2006 at 11:07 PM EST

As increasingly powerful computer chips both become denser and are crammed into increasingly smaller spaces, overheating can be a problem. Coming to the rescue, IBM Thursday announced that it has developed a new technique to address this very issue.

Specifically, “IBM researchers have found a way to draw twice as much heat off of hard-working computer chips, clearing the way for server farms and data centers to use denser, faster processors,” an InfoWorld Daily report said Oct. 26.

The new technique—high thermal conductivity interface technology—was inspired by the hierarchical branching found in tree roots, tree branches, and human veins.

» Full story @ TMCnet